New Interferometric Camera Offers Enhanced Dry Etch Endpoint Control

Building on more than 10 years experience in interferometric endpoint control of semiconductor dry etch and deposition processes, HORIBA Jobin Yvon are proud to release the latest in the range of LEM cameras.

The system includes a 670 or 905nm laser and when mounted on any dry etch process chamber with a direct top view of the wafer this generates a small laser spot on the sample surface. This allows the etch rate and thus etched thickness to be monitored in real time, providing enhanced process control for a wide variety of processes. Additionally interfaces can be detected by their change in reflectivity.

The LEM camera series is available in three versions:

• LEM - simple analog output, ideal for OEMs.
• LEM CT - includes full computer control powered by an easy to use recipe editor for advanced process monitoring. Ideal for OEMs and process development in industrial R&D environments.
• LEM PR - Extends the capabilities of the LEM CT with automatic spot positioning using Cognex® pattern recognition plus advanced communication capabilities. Ideal for volume fab production environments.

The LEM CT and LEM PR are fully compatible with our full range of process control tools which use optical emission, ellipsometry and polarimetry techniques. This allows us to provide the most appropriate solution for your application.