Grinding and polishing of a brass alloy

This application note describes the grinding, polishing, and etching process of two brass samples, one containing lead and the other lead-free, using QATM etchants. The QATM preparation method involves grinding the samples using SiC grinding paper P600 and P1200, polishing with GAMMA and ZETA diamond suspensions, and etching with Klemm II etchant for 40 seconds. The application note includes specific details of the equipment, pressure mode, rotational speed, dosing intervals for the process, and the microstructure of both samples after etching.