Leica EM TIC 3X Ion Beam Milling System
Leica Microsystems Europe The Triple Ion Beam Cutter, Leica EM TIC 3X allows production of cross sections of hard/soft, porous, heat sensitive, brittle and heterogeneous material for Scanning Electron Microscopy (SEM), Microstructure Analysis (EDS, WDS, Auger, EBSD) and, AFM investigations.