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Hysitron TI 980 TriboIndenter

24 Jul 2023

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Hysitron PI Series PicoIndenters

24 Jul 2023

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Hysitron PI 89 SEM PicoIndenter

24 Jul 2023

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Mechanical characterization of ultra-low-k dielectric films

23 Jul 2023

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Direct pull tension testing with the Hysitron PI 89 SEM PicoIndenter - A primer

23 Jul 2023

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Correlative microscopy and XPM: Mechanical property distribution by nanoindentation mapping

17 Jul 2023

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Strength engineering in a nickel-base superalloy

17 Jul 2023

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High-temperature investigation of a thermal barrier coating

17 Jul 2023

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<em>In-situ </em> fiber push-out tests with the Hysitron PI 88 SEM PicoIndenter

16 Jul 2023

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Multimodal correlative imaging of microplastics

9 Jul 2023

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Hysitron TI 980 TriboIndenter

Hysitron PI Series PicoIndenters

Hysitron PI 89 SEM PicoIndenter

Mechanical characterization of ultra-low-k dielectric films

Direct pull tension testing with the Hysitron PI 89 SEM PicoIndenter - A primer

Correlative microscopy and XPM: Mechanical property distribution by nanoindentation mapping

Strength engineering in a nickel-base superalloy

High-temperature investigation of a thermal barrier coating

<em>In-situ </em> fiber push-out tests with the Hysitron PI 88 SEM PicoIndenter

Multimodal correlative imaging of microplastics

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Selected Filters:

Hysitron TI 980 TriboIndenter

Hysitron PI Series PicoIndenters

Hysitron PI 89 SEM PicoIndenter

Mechanical characterization of ultra-low-k dielectric films

Direct pull tension testing with the Hysitron PI 89 SEM PicoIndenter - A primer

Correlative microscopy and XPM: Mechanical property distribution by nanoindentation mapping

Strength engineering in a nickel-base superalloy

High-temperature investigation of a thermal barrier coating

<em>In-situ </em> fiber push-out tests with the Hysitron PI 88 SEM PicoIndenter

Multimodal correlative imaging of microplastics

Resources Filter